Macro shot of a wire-bonded die

Die Wire Bonding (COB)

Bare die ASIC wire bonding directly to PCB — chip-on-board assembly for low-volume and prototype runs through to production.

Glob-top packaged dies on PCB pads

Die Packaging

Packaging options for bare die, matched to your volume, budget and reliability requirements.

Loose QFN packaged components

Component Sourcing

Sourcing of parts and materials across the supply chain, so your build isn't held up by a missing line item.

Macro shot of a wafer reticle under inspection

Testing

Product testing to catch issues before they leave the factory floor.

Batch of COB boards laid out for production

Manufacturing & Kitting

Manufacturing and kitting services on the ground in mainland China.

Finished COB board ready for delivery

Fulfillment

Fulfillment support to get finished product from the factory to your customers.